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ALPHA CVP390 Solder paste

ALPHA CVP390 Solder paste

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Description

ALPHA CVP390 Solder paste Lead free

ALPHA CVP390 solder paste lead free is a zero-halogen no-clean solder paste designed for applications where residue with excellent pin testing property and ability to pass JIS Copper Corrosion test are required. This product is also designed to enable consistent fine pitch printing capability, down to 180µm circle printed with 100µm thickness stencil. Its excellent print volume deposit repeatability also provides value by reducing defects associated with print process variability.  Additionally, ALPHA® CVP-390 achieves IPC7095 Class III voiding performance.

  • High Reliability
  • Exceeds IPC 7095 Class III Voids for soak profile and low voiding on large area deposits.
  • Reduced head in pillow defects
  • Outstanding reflow process window capable of 175-180 ºC soak for 60 second
  • Available in 500 gram jars, 6”& 12” cartridges
  • Multi-alloy capable including SAC305 and Innolot

Availability:

  • 155717 – CNP CVP390 771 88.8-4-M17 JAR 96.5SN/3.0AG/0.5CU 0.50KG
  • 156604 – CNP CVP390 771 88.8-4-M17 C06 96.5SN/3.0AG/0.5CU 0.60KG
  • 158173 – CNP CVP390 771 88.8-M20 JAR SAC305 PT4.5 0.50KG
  • other formats available on request

Key features:

  • Long Stencil Life giving consistent performance for at least 8 hours of continuous printing without the addition of new paste
  • Long, High Tack Force Life that ensures high pick-and-place yields, good self-alignment
  • Wide Reflow Profile Window that allows best quality solderability of complicated, high density PWB assemblies in both air and nitrogen reflow, using ramp and soak profiles, as high as 175 to 185°C
  • Reduced Random Solder Ball Levels: minimizes rework and increases first time yield
  • Excellent Coalescence and Wetting Performance: coalesced 180µm circle deposit, even at high soak profile environment
  • Exceptional Solder Joint and Flux Residue Cosmetics: after reflow soldering, even using long/high thermal soaking, without charring or burning
  • Outstanding Voiding Performance: Meets IPC7095 Class III Requirement
  • Halogen Content: Zero Halogen, no halogen intentionally added
  • Residue: Excellent Pin Testing property and Pass JIS Copper Corrosion Test
  • Safe and Environmentally Friendly: Materials comply with RoHS and Halogen-free requirements (see table below), as well as TOSCA & EINECS

 

Advanced Manufacturing Services (AMS) Limited is proud to be the UK/ Ireland distributors for Alpha from 1st April 2020.  We have a wealth of material and process knowledge so please call to discuss your application with one of our engineers,  contact us by email or call +44 1260 270950

Downloads

OM-338 CSP TB SM901 ENGLISH
155717- CVP390 UK-GB
156604 CNP CVP390 771 88.8-4-M17 C06 96.5SN_3.0AG_0.5CU 0.60Kg
158173 Alpha CVP-390 771 88.8-M20 Jar SAC305 T4.5 0.50Kg

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