Description
Alpha JP-500 jet printing solder paste SAC305
Alpha JP-500 jet printing solder paste SAC305 is formulated to deliver excellent visual joint cosmetics and is rated ROL0 per IPC J-STD-004. ALPHA JP-500 features a rheology capable of standard dispensing or jetting.
This paste is formulated to offer best-in-class in circuit pin test yields and high electrochemical reliability. Alpha JP-500 jet printing solder paste offers outstanding reflow process window and solderability across all traditional surface finishes.
Availability:
- 153833 Alpha JP500 for jet printing solder paste 771 87-5-M11 S30W SAC305 0.100Kg
Key Features:
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”)
- Excellent deposit consistency with high process capability index across all board designs
- Designed for use with the Mycronic Jet Printers
- Zero Halogen (no halogen intentionally added to the formulation)
- Wide reflow profile window with good solderability on various board / component finishes
- Excellent solder and flux cosmetics after reflow soldering
- Reduction in random solderballing levels, minimising rework and increasing first time yield
- Excellent pin-test yield for single and double reflow
- Meets highest IPC 7095 voiding performance classification of Class III
- Excellent reliability properties, zero halide material
- Capable of high reflow yield without the use of nitrogen
Advanced Manufacturing Services (AMS) Limited is proud to be the UK/ Ireland distributors for Alpha products. We have a wealth of material and process knowledge so please call to discuss your application with one of our engineers, contact us by email or call +44 1260 270950.
We stock a wide range of Alpha solder bars, paste, wire and flux – please contact us for more information.
