Description
Alpha HiTech Edgebond
ALPHA HiTech Edgebond is a one component, heat curable material. It is an epoxy material to be dispensed on the corners of the BGA. Upon deposition, it will not flow beneath the BGA, an important criterion to avoid contact with outer solder balls. The cured Edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).
ALPHA Edgebond end market is in portables such as Graphic Cards, Notebook, Tablets, as well as assembled boards in Automotive and Medical accessories. Users of the ALPHA Hi-Tech Edgebond product can benefit from the following key product features:
- An excellent lower cost option to conventional underfilling process since higher material volume for capillary flow is not required
- Offers an effective process option to conventional underfilling process
- Has excellent adhesion to FR4
- Halogen Free
CF12-4485B Edgebond Epoxy
ALPHA HiTech CF12-4485B is a one-component, low temperature cure, Edgebond epoxy system. It is designed to provide protection to the solder joint during mechanical stress. It is an excellent and effective low cost option to conventional underfilling process because higher material volume for capillary flow is not required.
Key Features:
- Excellent Adhesion Strength
- Excellent Thermal Cycling performance
- Multiple Curing Options Available
- Halogen Free
- Complies with RoHS Directive 2011/65/EU
CF31-4010 Heat Curable Edgebond Epoxy
ALPHA HiTech CF31-4010 is a one component, high filler content, heat curable Edgebond. It is an epoxy- based material to be dispensed on the corners (corner bonding) or edges (edge bonding) of the BGA devices. It is a one component, high filler content, heat curable Edgebond. It is an epoxy- based material to be dispensed on the corners (corner bonding) or edges (edge bonding) of BGA devices. Upon completion of the curing process, the cured Edgebond helps to strengthen the soldered assembled component allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle Test (TCT). All ALPHA HiTech Products are Halogen-Free.
Key Features:
- An excellent lower cost option to conventional underfilling process with increased productivity and lower material volume required
- High Tg and Low CTE values drastically improve the product’s ability to pass a more stringent Thermal Cycling Test condition
- Although ALPHA HiTech CF31-4010 is a high Tg, low CTE and high filler content material, it is reworkable
- Halogen-free and complies with RoHS Directive 2015/863/EU
Advanced Manufacturing Services are the proud distributors of Alpha soldering products within the UK and Ireland. Please contact us to discuss your product requirements.