Reducing solder voids in joints
Reducing solder voids in joints
There is general consensus in the electronics assembly industry that solder joints with a low level of voids are more resistant to mechanical stress and more electrically and thermally conductive. Achieving low voiding in a solder joint requires the use of specially designed soldering materials in combination with carefully controlled process conditions. We have both the materials and process knowledge to help our customers achieve the lowest voiding possible.
A lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components. This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
- ≤10% voiding on large area bottom terminated components
- Controlled void distribution for enhanced process stability to minimize rework
- Available in T4 powder for Pb-free applications with both Innolot high reliability alloy & SAC305
- Excellent electrochemical reliability on bottom terminated components
ALPHA OM-358 is a lead-free, zero-halogen, no-clean solder paste designed to provide ultra-low voiding performance on all component types including bottom termination components.
ALPHA OM-358 achieves IPC7095 Class III voiding on BGA components and less than 10% voiding on bottom termination components. This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
