Description
ALPHA OM-362 Solder paste – ultra-low voiding and high-reliability
ALPHA OM-362 Solder paste is a lead-free, zero-halogen, no-clean solder paste available in T4 powder. It is designed to provide ultra-low voiding performance on all component types including bottom terminated components.
ALPHA OM-362 achieves IPC Class III voiding on BGA components averaging less than 10% voiding on Bottom Terminated Components (BTC). This paste is designed for ultra-low voiding performance with high reliability alloys such as Innolot as well as traditional SAC alloys.
Key features:
- Ultra low voiding performance – enables increased process stability, and enhances thermal and electrical performance of the most demanding component applications
- Excellent electromigration characteristics- passes J-STD-004C IPC-TM-650 at 200µm to ensure electrical reliability and functionality of fine-pitched components
- Wide reflow profile window- enables high quality solderability of complicated, high density PCB assemblies using straight ramp and soak profiles, as high as 150ºC at 200ºC soak
- Good coalescence and wetting performance – coalesces down to 180µm exhibiting good wetting characteristics and solder joint reliability
- Excellent solder joint and flux residue cosmetics – easily penetrable and clear flux residue enables good probe contact during quality inspection
- Zero halogen, no halogens intentionally added – ensures RoHs compliance for a safe and environmentally friendly assembly process
We recommend the use of Alpha stencils to ensure the best printing – for further information visit the stencil page here
Advanced Manufacturing Services (AMS) Limited is proud to be the UK/ Ireland distributors for Alpha from 1st April 2020. We have a wealth of material and process knowledge so please call to discuss your application with one of our engineers, contact us by email or call +44 1260 270950
