Description
ALPHA NR-330 No clean flux
ALPHA NR-330 No clean flux, formerly development #9225, is a VOC-free, halide-free, rosin/resin-free, low solids, no-clean flux. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill particularly to bare copper with OSP’s. Several proprietary additives are also formulated into NR-330 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of NR-330 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging.
Key features:
- Bellcore compliant for assemblies requiring this standard.
- VOC-free to help meet air quality regulations.
- Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows.
- Thermally stable activators provide low solder bridging.
- Reduces the surface tension between solder mask and solder to provide low solderball frequency.
- Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics.
- Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag.
- Supplied in 10 Litre containers
Advanced Manufacturing Services (AMS) Limited are proud to be the UK/ Ireland distributors for Alpha from 1st April 2020.
