Description
Alpha HiTech Encapsulants
ALPHA HiTech Encapsulants are one component, intermediate temperature, fast heat curable materials. They are designed to mechanically protect the assembled chips and IC devices from dropping off and cracking. The HiTech Encapsulants are designed for a wide range of markets including automotive, mobile devices and camera modules.
ALPHA Hi-Tech Encapsulants are formulated for applications in portables (e.g. smartphones) requiring extra reliability protection.
Key features:
- Specially formulated Thixotropic Index (TI) for optimal dispensing performance
- Excellent non-sagging property to minimize spread after dispensing process
- Able to impart excellent water proofing attribute
- Prevent migration formation
- Excellent adhesion property on FR4, Flexible Polyimide and Chip components
- Halogen Free
EN31-4007 Solder Joint Strengthening Encapsulants
ALPHA HiTech EN31-4007 Series of encapsulants are one-component epoxy systems designed to improve the attachment strength of solder joints by encapsulating the material over the chip component. These products prevent chip and IC devices from dropping out. For Glob Top, these protect the chip/die from cracking.
ALPHA HiTech EN31-4007 Series excellent flexibility allows it to dynamically flex in tandem with components and prevent cracking, especially in FPCB assembly process. These products have been tested to provide Excellent Adhesion on FR4, Flexible Polyimide(FPC) and PET substrates. Users of ALPHA HiTech EN31-4007 Series of encapsulants have the option to perform rework as needed as the products are highly reworkable.
Key Features:
- Excellent Impact Bending
- Excellent Drop Shock
- Excellent Impact Resistance
- Highly Reworkable
- Imparts Water Proofing Property
- Complies with RoHS Directive 2011/65/EU
- Halogen Free
- Available in Pale Yellow, Black and Fluorescent colors
EN21-4210 Solder Joint Strengthening Encapsulants
ALPHA HiTech EN21-4210 Series of products are one-component epoxy systems designed to encapsulate the chip component thus protecting the device and strengthening the solder joints. It prevents chip and IC devices from dropping out. In addition, it protects the chip/die from cracking when used as a Glob Top.
ALPHA HiTech EN21-4210 Series has a high hardness property which makes it very suitable for assembly of components requiring excellent reinforcement strength. ALPHA HiTech EN21-4210 Series is a non-reworkable encapsulant product option.
Key Features:
- Excellent Impact Bending
- Excellent Drop Shock
- Excellent Impact Resistance
- Halogen Free
- Impart Water Proofing Property
- Complies with RoHS Directive 2011/65/EU
Advanced Manufacturing Services (AMS) Limited are proud to be the UK/ Ireland distributors for Alpha. For further information on the full range of Alpha soldering consumables, please contact us.