Description
Mirtec MS-11 3D SPI solder paste inspection system
The Mirtec MS-11 3D SPI solder paste inspection system is a premium inline 3D SPI system engineered for SMT and semiconductor applications. It delivers exceptional accuracy, speed, and automation to enhance production quality and throughput.
Key Features
- 0201 mm Pad Inspection – Accurately measures solder paste on mini‑LEDs as small as 0201 mm and as low as 30 µm in height, enhancing precision on components with tight tolerances
- High‑Resolution Camera & Telecentric Lens – Employs a 25 MP camera paired with 4 µm/6 µm telecentric lenses, ensuring distortion-free, high‑clarity imaging
- Large Field of View (FOV) – Captures clear, expansive images in a single shot to reduce inspection cycles and speed up processing
- Warpage Compensation – Detects and compensates for PCB warpage and twist in real time, ensuring reliable inspection on bent or warped boards
- Optional Solder Repair System (SRS) – Integrates an optical system with solder dispenser to automatically repair pads identified with insufficient or missing solder
- Shadow-Free Dual Projection (Moiré Phase‑Shift Imaging) – Enhances 3D measurement accuracy by eliminating shadows, ensuring clear volume, shape, and alignment inspection
- Fast, Accurate Performance – Features high-speed CoaXPress (CXP) or Camera Link interface options and up to 25 MP resolution for rapid, precise throughput
- Closed‑Loop Connectivity – Supports closed-loop feedback with screen printers and pick‑and‑place machines for real-time process optimization.
Benefits
- Superior Inspection Precision – Designed for advanced mini‑LED inspection with industry-leading resolution and measurement fidelity
- Accelerated Throughput – Wider FOV and high-speed camera interfaces combine for faster PCB inspection cycles
- Enhanced Process Automation – From solder repair to closed-loop feedback, MS‑11 reduces manual intervention and improves yield
- Adaptability & Reliability – Telecentric optics and warpage compensation provide accurate results across varied board conditions.
The Mirtec MS‑11 3D SPI solder paste inspection system is ideal for PCB manufacturers and electronics assembly lines requiring high-resolution, high-throughput 3D SPI—especially where miniaturised components and tight quality control are critical.
For further information, to request a demonstration or a quotation, please contact us. Advanced Manufacturing Services are the proud UK and Ireland distributors for Alpha Soldering consumables.
