Description
ALPHA OM-358 Solder paste – Superior void performance and controlled void distribution
ALPHA OM-358 Solder paste is engineered to provide the lowest voiding performance on large area bottom terminated components. This paste regularly achieves less than 10% voiding on low standoff devices with large termination pads such as QFN, DPAK, and QFP’s.
More importantly, ALPHA OM358 controls the average void distribution from board-to-board to enhance process stability and maintain consistent electrical and thermal performance.
Alpha OM-358 achieves IPC class III voiding on BGA components and less than 10% voiding on bottom termination components. This paste is designed for ultra- low voiding performance with high reliability alloys such as Innolot.
Key features:
- Ultra low voiding performance – increases process stability, thermal, and electrical performance of the most demanding component applications
- Excellent electromigration characteristics – passes J-STD-004B IPC-TM-650 at 100µm to ensure electrical reliability and functionality of fine-pitched components
- Wide reflow profile window- enables high quality solderability of complicated, high density PCB assemblies using straight ramp and soak profiles, as high as 150 °C to 200°C soak
- Good random solder ball levels – minimises rework and increases first pass yield
- Good coalescence and wetting performance – coaelesces down to 170µm exhibiting good wetting characteristics and solder joint reliabilty
- Excellent solder joint and flux residue cosmetics – easily penetrable and clear flux residue enables good probe contact during quality inspection
Advanced Manufacturing Services (AMS) Limited is proud to be the UK/ Ireland distributors for Alpha from 1st April 2020. We have a wealth of material and process knowledge so please call to discuss your application with one of our engineers, contact us by email or call +44 1260 270950
