Description
ALPHA OM340 Solder paste Lead free
ALPHA OM340 solder paste is the all-rounder in the Alpha solder paste portfolio, a lead-free, no-clean solder paste designed for a broad range of applications. A big benefit from this all-rounder is that it provides best in class low defect rate for Head in Pillow defects combined with excellent first pass yield on ICT/pin testing. OM-340 also displays excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability and high “through-put” applications
Outstanding reflow process window delivers superior soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, excellent random solder ball resistance and mid-chip solder ball performance. ALPHA OM-340 is formulated to deliver excellent visual joint cosmetics and best in class in circuit pin test yields. Additionally, ALPHA OM-340’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability.
- Available in 500 gram jars, 6” & 12” cartridges
- Available in multiple alloys
- A great all round product designed for universal market applications
- Zero Halogen
- Fine feature
- Excellent solder and flux cosmetics after reflow soldering
- Low head in Pillow defects
Availability: –
- 152800 – CNP OM340 771 88.3-4-M18 JAR 96.5SN/3.0AG/0.5CU 0.50KG
- 174983 – CNP OM340 246 88.3-4-M18 JAR SACX0307 0.50KG
- 154190 – CNP OM340 771 88.3-4-M18 C06 96.5SN/3.0AG/0.5CU 0.60KG
- 157677 – CNP OM340 969 88.3-4-M18 C06 Innolot 0.6Kg
- Other alloys and packaging formats are available on request.
Key features:
- Maximizes reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 200μm (8 mil) with 100μm (4 mil) thick stencils
- Excellent print consistency with high process capability index across all board designs
- Print speeds of up to 150mm/sec (6”/sec), enabling a fast print cycle time and a high throughput
- Wide reflow profile window with good solderability on various board / component finishes
- Excellent solder and flux cosmetics after reflow soldering
- Best in class low defect rate for Head in Pillow
- Best in class in circuit pin test yield
- Reduction in random solderballing levels, minimizing rework and increasing first time yield
- Meets highest IPC 7095 voiding performance classification of Class III
- Excellent reliability properties, halide-free material
- Compatible with either nitrogen or air reflow
- Zero halogen (No halogen intentionally added to the formulation)
Advanced Manufacturing Services (AMS) Limited is proud to be the UK/ Ireland distributors for Alpha. We have a wealth of material and process knowledge so please call to discuss your application with one of our engineers, contact us by email or call +44 1260 270950
