Description
ALPHA OM-565 HRL3 low temperature solder paste
ALPHA OM-565 HRL3 low temperature solder paste is designed to mitigate warpage induced defects in temperature sensitive chip-scale packages. The solder paste enables peak reflow temperatures of 175 °C and superior wettability to minimize post reflow defects such as Non-Wet-Open (NWO) and Head-in-Pillow (HIP).
The ALPHA OM-565 chemistry enhances electrochemical performance over existing low melt point solders and provides excellent compatibility when used in combination with alternative ALPHA solutions for contact rework applications.
Products Features
- Compatibility with HRL3 alloy for enhanced thermomechanical and drop shock reliability.
- The HRL3 alloy enables peak reflow temperature of 175 °C to mitigate warpage induced defects.
- Low melt point reflow improves energy efficiency and reduces energy costs in the assembly process.
- Superior HiP/NWO performance.
- Compatibility with contact rework applications.
- 8-hour stencil life in ambient and elevated conditions.
Minimizes Warpage Induced Defects to Maximize Assembly Yield
Next generation devices require a larger footprint and thinner form factor design that deliver superior processing power over current technologies. These next generation packages create challenges for assembly at traditional SMT reflow temperatures. The ALPHA OM-565 HRL3 enables a reduction in peak reflow down to 175 °C to mitigate common warpage induced defects such as HiP and NWO to improve assembly yields.
HRL3 Alloy Improves Reliability Over Existing Low Temperature Solutions
ALPHA OM-565 HRL3 microalloying additions continue to enhance the mechanical reliability over existing best-in-class low temperature solutions. The resulting ductility of the HRL3 alloy and superior wettability of the ALPHA OM-565 chemistry further advances the drop shock performance of low melt point alloys.
Enhances the Environmental Sustainability of the Assembly Process
The HRL3 alloy offers a significant reduction in peak reflow temperature over existing SAC reflow conditions. The ability to reliably solder at 175 °C peak temperatures will increase the efficiency of existing assembly processes while lowering the manufacturers net impact on its surrounding environment.
Advanced Manufacturing Services (AMS) Limited is proud to be the UK/ Ireland distributors for Alpha products. We have a wealth of material and process knowledge so please call to discuss your application with one of our engineers, contact us by email or call +44 1260 270950.
We stock a wide range of Alpha solder bars, paste, wire and flux – please contact us for more information.
For troubleshooting, please refer to the Alpha Assembly Solutions SMT Troubleshooting Guide
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