Description
Alpha WS-820 solder paste SAC305 water soluble
Alpha WS-820 solder paste SAC305 water soluble is the newest Alpha brand lead free, halide free, solder paste, offering the ideal combination of printability and reflow profile process window with excellent cleanability in a lead free alloy solder paste.
ALPHA WS-820 was formulated to meet the requirements of water soluble solder lead free applications, and it was developed to increase the reflow profile window of WS-819, while offering exceptional post reflow cleanability and low BGA voiding.
This paste is designed to enable users of ALPHA WS-609, WS-709 and WS-809 and other leading water soluble paste brands to comply with RoHS and customer based demand for lead free materials.
Availability:
- 153515 CNP WS820 771 87.5-4-M18 JAR 96.5SN/3.0AG/0.5CU 0.50KG
- 152996 CNP WS820 771 88-3-M19 JAR 96.5SN/3.0AG/0.5CU 0.50KG
Key Features:
- Able to spread and wet using straight ramp or soak reflow profiles in air
- High spread/wetting lead free paste compatible with lead free alloys and surface finishes
- High Reflow Yield with IPC Class II Voiding Performance when used to solder BGA components
- Excellent wetting characteristics on all common surface finishes (including Entek HT OSP). JIS Spread 88.6% on Entek HT OSP.
- Cleanable with water based cleaning systems
Advanced Manufacturing Services (AMS) Limited is proud to be the UK/ Ireland distributors for Alpha products. We have a wealth of material and process knowledge so please call to discuss your application with one of our engineers, contact us by email or call +44 1260 270950.
We stock a wide range of Alpha solder bars, paste, wire and flux – please contact us for more information.
