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ALPHA OM550 HRL1 solder paste

ALPHA OM550 HRL1 solder paste

SKU: 243872 Category:

Description

ALPHA OM550 HRL1 solder paste

ALPHA OM550 HRL1 solder paste is a high reliability, low-temperature solder paste. The HRL1 alloy in this paste has a melting point significantly lower than SAC305 which will help to increase production yield and reduce component warpage.

Together, the flux and alloy combine to make a product that has the characteristics of a traditional solder paste used in high end CPUs but with a low solder melting point therefore minimizing post reflow warpage induced defects.

The very latest low temperature offer; ALPHA OM550 HRL1 solder paste is a new low temperature chemistry paired with the ALPHA® HRL1 alloy. This alloy was designed to exhibit improved drop shock and thermal cycling performance versus existing low temperature alloys. Together, the flux and alloy blend to make a product that has the characteristics of a modern solder paste designed for motherboards but with the ability to reflow at lower temperatures therefore minimizing NWO and HIP defects in complex assemblies.

  • OM550 HRL1 is a high reliability, low-temp solder paste.
  • The alloy in this paste has a melting point significantly lower than SAC305.
  • A minimum peak temp of only 185°C v 245°C reduces energy consumption in the SMT process.
  • Designed to increase production yield & reduce component warpage.

Availability: –

  • 243872 – CNP OM550 HRL1 88-4-M19 JAR HRL1 0.5Kg

Improved Reliability v Low Temp Alloys

  • Joints formed with ALPHA® OM-550, HRL1 have improved mechanical reliability over other low temperature alloys.
  • Drop shock performance in mixed alloy joints increased by 100% compared to other SnBi alloys.
  • Thermal cycling reliability in mixed alloy joints improved by 20%.
  • HRL1 alloy shows best compatibility with SAC alloy versus other low temperature SnBi alloys.

ALPHA OM550 HRL1 Solder paste Offers Many Benefits

  • Long Stencil Life: Tested up to 12 hours of continuous printing.
  • Good voiding on various packages: BGAs, MLFs, DPAK, LGAs.
  • Low temp reflow eliminates Head-in-Pillow & NWO defect.
  • Air & N2 reflow capable.
  • Compatible with SAC305 components!

 

Advanced Manufacturing Services (AMS) Limited is proud to be the UK/ Ireland distributors for Alpha.  We have a wealth of material and process knowledge so please call to discuss your application with one of our engineers,  contact us by email or call +44 1260 270950

Downloads

ALPHA OM-550 Solder Paste EN 30Aug19 TB_6
243872 CNP OM550 HRL1 88-4-M19 JAR
ALPHA-OM-550-Solder-Paste-EN-08Apr22-TB
Alpha-OM-550-HRL1-Solder-Paste-EN-A4-10Jan22-FL

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