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ALPHA OM-338 Solder paste Lead free

ALPHA OM-338 Solder paste Lead free

SKU: 143724 143999 144540 Category:

Description

ALPHA OM-338 Solder paste Lead free

ALPHA OM-338 Solder paste Lead free is a no-clean solder paste designed for a broad range of applications. OM-338’s broad processing window is designed to minimize transition concerns from tin/lead to lead free solder paste. This material is engineered to deliver the comparable performance to a tin lead process.* ALPHA OM-338 yields excellent print capability performance across various board designs and, particularly, with ultra fine feature repeatability (11 mil Squares) and high throughput applications. Outstanding reflow process window delivers good soldering on CuOSP with excellent coalescence on a broad range of deposit sizes, exceptional random solder ball resistance and mid-chip solder ball performance.

ALPHA OM-338 is formulated to deliver excellent visual joint cosmetics. Additionally, ALPHA OM-338’s capability of IPC Class III for voiding and ROL0 IPC classifications ensures maximum long-term product reliability. *Although the appearance of these lead-free alloys will be different to that of tin-lead, the mechanical reliability is equal to or greater than with that of tin-lead or tin-lead-silver.

Availability:

  • 143724 – CNP OM338 771 88.5-3-M11 S10 96.5SN/3.0AG/0.5CU 0.04KG
  • 143999 – PFL OM338 Paste Flux S10 .010KG
  • 144540 – CNP OM338 696 83.3-3-M04 S10 95.5SN/4.0AG/0.5CU 0.04KG

Key features:

  • Maximises reflow yield for lead-free processing, allowing full alloy coalescence at circular dimensions as small as 0.25mm (0.010”) with 0.100mm (4mil) stencil thickness
  • Excellent print consistency with high process capability index across all board design
  • Print speeds of up to 200mm/sec (8”/sec), enabling a fast print cycle time and a high throughput
  • Wide reflow profile window with good solderability on various board / component finishes
  • Excellent solder and flux cosmetics after reflow soldering
  • Reduction in random solderballing levels, minimising rework and increasing first time yield
  • Meets highest IPC 7095 voiding performance classification of Class III
  • Excellent reliability properties, halide-free material
  • Compatible with either nitrogen or air reflow

Advanced Manufacturing Services (AMS) Limited are proud to be the UK/ Ireland distributors for Alpha from 1st April 2020.

Downloads

ALPHA OM-338 CNP TB SM817-20 ENGLISH 20190520
143724 96.5Sn_3Ag_0.5Cu OM-338 Solder Paste 88.5-3-M11 Syr 0.04Kg
143999 Alpha OM-338 Paste Flux Syr 0.01Kg
144540 OM-338 696 83.3-3-M04 S10 95.5Sn_4.0Ag_0.5Cu 0.04Kg

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